Home
Typhoon HIL Hardware Manual
HIL Paralleling Guide
This document introduces the HIL paralleling concept, defines modeling of relevant link parameters, and explains how to properly connect multiple Typhoon HIL devices.
Multi-HIL system architecture parameters
In this section, modeling parameters for multi-HIL models are listed and described.

Typhoon HIL Hardware Manual
- Hardware Manual Introduction
  Collection of some of the guides on the deployment, use, and management of Typhoon HIL hardware devices.
- HIL101 Hardware User Guide
  Official documentation of the HIL101 simulator hardware device.
- HIL402 Hardware User Guide
  Official documentation of the HIL402 simulator hardware device.
- HIL404 Hardware User Guide
  Official documentation of the HIL404 simulator hardware device.
- HIL506 Hardware User Guide
  Official documentation of the HIL506 simulator hardware device.
- HIL602+ Hardware User Guide
  Official documentation of the HIL602+ simulator hardware device.
- HIL604 Hardware User Guide
  Official documentation of the HIL604 simulator hardware device.
- HIL606 Hardware User Guide
  Official documentation of the HIL606 simulator hardware device.
- HIL Paralleling Guide
  This document introduces the HIL paralleling concept, defines modeling of relevant link parameters, and explains how to properly connect multiple Typhoon HIL devices.
  - Overview
    Introduction to HIL Paralleling
  - High speed serial link specification
    Detailed description of the link specification and parameters when paralleling HIL devices
  - Multi-HIL system architecture parameters
    In this section, modeling parameters for multi-HIL models are listed and described.
  - HW setup
    Instructions on how to setup a parallel connection of hardware devices.
- Hardware Interfacing Guide
  Tips and examples on how to connect any controller to the HIL.
- HIL dS Interface Type-A
  Information about the HIL dS Interface Type-A, an interface board which allows for connecting dSPACE hardware to Typhoon HIL simulators.
- HIL dS Interface Type-B
  Information about the HIL dS Interface Type-B, an interface board which allows for connecting dSPACE hardware to Typhoon HIL simulators.
- HIL dS Interface Type-C
  Information about the HIL dS Interface Type-C, an interface board which allows for connecting dSPACE hardware to Typhoon HIL simulators.
- HIL Breakout Board
  Information about the HIL Breakout Board, a passive breakout board which provides easy access to individual HIL signals.
- HIL Connect
  Information about the HIL Connect, a 19" 6U interface device, designed to adapt HIL IO signal levels to those most commonly used in the industry.
- HIL DSP 180 Interface
  Information about the HIL DSP 180 Interface, an interface board which allows for connecting Texas Instruments Control Card boards to Typhoon HIL simulators.
- HIL TI Launchpad Interface
  Information about the HIL TI Launchpad Interface, an interface board which allows for connecting TI's LaunchPad™ boards to Typhoon HIL simulators.
- HIL TI uGrid Launchpad Interface
  Information about the HIL TI uGrid Launchpad Interface, an interface board which allows for connecting up to three TI LaunchPad™ boards to Typhoon HIL simulators.
- HIL4/6 Calibration Card
  Information about the HIL4 and HIL6 Calibration Card accessories designed for one-click calibration of all HIL4 and HIL6 series devices.
- HIL Infineon TriBoard Interface
  Information about the HIL Infineon TriBoard Interface, an interface board which allows for connecting Infineon TriBoard evaluation boards to Typhoon HIL simulators.
- HIL CCS Interface
  Information about the HIL CCS Interface, a dedicated module for testing smart charge communication of electric vehicles and electric vehicle supply equipment.

Multi-HIL system architecture parameters

In this section, modeling parameters for multi-HIL models are listed and described.

Table 1. High speed serial link parameters
Parameter	HIL101	HIL404	HIL602+	HIL604	HIL506	HIL606
Maximum number of devices in the chain	4	4	4	16	16	16
Maximum number of electric variables that one SPC can send to and receive from SPCs in other devices¹	8	8	8	8	8	8
Maximum number of electric variables that one device can send to and receive from other devices²	16	16	16	16	16	16
Maximum number of signal processing variables per stream³	16	16	16	16	16	16
Maximum number of signal processing streams between two devices (in each direction)⁴	4	4	16	16	16	16
Simulation time synchronization⁵	Yes	Yes	Yes	Yes	Yes	Yes

Electrical variables between two devices are sent through the device coupling element. Depending on the type of coupling element, the number of variables that the SPCs send are:
- Single Phase Device Coupling - one variable
- Three Phase Device Coupling - two variables
- Four Phase Device Coupling - three variables
- Single Phase TLM Device Coupling - one variable
- Three Phase TLM Device Coupling - three variables
- Four Phase TLM Device Coupling - three variables
For example, with a HIL602+ device, it is possible to connect one SPC to other devices with at most 2 Three Phase Coupling Devices.
Independent of the previous constraint, it is possible to transfer up to 16 electric variables from a part of model assigned to one HIL device to other parts of the model. This restriction is made because of the transferring capacity of HIL devices.
Signal processing variables are transferred between devices using the Device Transition component. Every Device Transition component defines one stream. This restriction simply means you can transfer up to 16 signal processing variables through one Device Transition.
Independent of the previous constraint, there is a maximum number of Device Transition components between two devices. For example, you can connect two HIL 602+ devices with a maximum of 4 streams (each with a maximum of 16 signal processing variables).
All paralleled HIL devices are synchronized with the master HIL (the HIL with ID0).