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Typhoon HIL Hardware Manual
HIL Paralleling Guide
This document introduces the HIL paralleling concept, defines modeling of relevant link parameters, and explains how to properly connect multiple Typhoon HIL devices.
High speed serial link specification
Detailed description of the link specification and parameters when paralleling HIL devices

Typhoon HIL Hardware Manual
- Hardware Manual Introduction
  Collection of some of the guides on the deployment, use, and management of Typhoon HIL hardware devices.
- HIL101 Hardware User Guide
  Official documentation of the HIL101 simulator hardware device.
- HIL402 Hardware User Guide
  Official documentation of the HIL402 simulator hardware device.
- HIL404 Hardware User Guide
  Official documentation of the HIL404 simulator hardware device.
- HIL506 Hardware User Guide
  Official documentation of the HIL506 simulator hardware device.
- HIL602+ Hardware User Guide
  Official documentation of the HIL602+ simulator hardware device.
- HIL604 Hardware User Guide
  Official documentation of the HIL604 simulator hardware device.
- HIL606 Hardware User Guide
  Official documentation of the HIL606 simulator hardware device.
- HIL Paralleling Guide
  This document introduces the HIL paralleling concept, defines modeling of relevant link parameters, and explains how to properly connect multiple Typhoon HIL devices.
  - Overview
    Introduction to HIL Paralleling
  - High speed serial link specification
    Detailed description of the link specification and parameters when paralleling HIL devices
  - Multi-HIL system architecture parameters
    In this section, modeling parameters for multi-HIL models are listed and described.
  - HW setup
    Instructions on how to setup a parallel connection of hardware devices.
- Hardware Interfacing Guide
  Tips and examples on how to connect any controller to the HIL.
- HIL dS Interface Type-A
  Information about the HIL dS Interface Type-A, an interface board which allows for connecting dSPACE hardware to Typhoon HIL simulators.
- HIL dS Interface Type-B
  Information about the HIL dS Interface Type-B, an interface board which allows for connecting dSPACE hardware to Typhoon HIL simulators.
- HIL dS Interface Type-C
  Information about the HIL dS Interface Type-C, an interface board which allows for connecting dSPACE hardware to Typhoon HIL simulators.
- HIL Breakout Board
  Information about the HIL Breakout Board, a passive breakout board which provides easy access to individual HIL signals.
- HIL Connect
  Information about the HIL Connect, a 19" 6U interface device, designed to adapt HIL IO signal levels to those most commonly used in the industry.
- HIL DSP 180 Interface
  Information about the HIL DSP 180 Interface, an interface board which allows for connecting Texas Instruments Control Card boards to Typhoon HIL simulators.
- HIL TI Launchpad Interface
  Information about the HIL TI Launchpad Interface, an interface board which allows for connecting TI's LaunchPad™ boards to Typhoon HIL simulators.
- HIL TI uGrid Launchpad Interface
  Information about the HIL TI uGrid Launchpad Interface, an interface board which allows for connecting up to three TI LaunchPad™ boards to Typhoon HIL simulators.
- HIL4/6 Calibration Card
  Information about the HIL4 and HIL6 Calibration Card accessories designed for one-click calibration of all HIL4 and HIL6 series devices.
- HIL Infineon TriBoard Interface
  Information about the HIL Infineon TriBoard Interface, an interface board which allows for connecting Infineon TriBoard evaluation boards to Typhoon HIL simulators.
- HIL CCS Interface
  Information about the HIL CCS Interface, a dedicated module for testing smart charge communication of electric vehicles and electric vehicle supply equipment.

High speed serial link specification

Detailed description of the link specification and parameters when paralleling HIL devices

The HIL paralleling feature is supported by all HIL devices. Paralleling is possible across devices of the same model, as well as between HIL506 and HIL606 devices. The maximum number of devices in parallel is dependent on the link parameters.

Physical layer

HIL device models use different physical interfaces, as follows:

HIL602+ and HIL604 - PCIe x4
HIL101 and HIL404 - SFP+
HIL506 and HIL606 - QSFP28

Link layer

The high speed serial link uses Xilinx Aurora link-layer protocol.

Table 1. High speed serial link parameters
Device	Operating frequency	Number of lanes	Maximum data rate – device to device
HIL101	5 GHz	1	125 variables/μs
HIL404	5 GHz	1	125 variables/μs
HIL602+	5 GHz	8	1000 variables/μs
HIL604	5 GHz	8	1000 variables/μs
HIL506 and HIL606	16 GHz	4	1000 variables/μs

Maximum data rate refers to the maximum number of electric and signal processing variables which can be transferred in one microsecond.